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Enhanced Sputtering

Enhanced sputtering employs a low-voltage arc discharge in the centre of the chamber to create a plasma intensity several times greater than the basic sputtering procedure, and thus to produce a much higher degree of particle ionization in the gaseous phase.

  1. Electron beam source
  2. Argon
  3. Reactive gas
  4. Planar magnetron evaporation source (coating material)
  5. Components/Tools
  6. Low-voltage arc discharge
  7. Auxiliary anode
  8. Vacuum pump

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