Enhanced Sputtering
Enhanced sputtering employs a low-voltage arc discharge in the centre of the chamber to create a plasma intensity several times greater than the basic sputtering procedure, and thus to produce a much higher degree of particle ionization in the gaseous phase.
- 1. Electron beam source
- 2. Argon
- 3. Reactive gas
- 4. Planar magnetron evaporation source (coating material)
- 5. Components/Tools
- 6. Low-voltage arc discharge
- 7. Auxiliary anode
- 8. Vacuum pump
