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Solution Coating material Coating technology Microhardness HIT (GPa) Coefficient of friction (dry) vs. steel Max. service temp. [°C] Process temperature
BALINIT DYLYN a-C:H:Si PACVD ~15-25 0.0 5- 0.2 300 < 220
BALINIT A TiN Arc 30 +/- 3 ~0.6 600 < 500
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Semiconductor wafer transfer mechanisms

BALINIT DYLYN coatings are used for the reduction of contamination and tunable conductivity. BALINIT A (TiN) is used for higher conductivity than DYLYN.