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Semiconductor wafer transfer mechanisms

Semiconductor wafer transfer mechanisms

BALINIT DYLYN coatings are used for the reduction of contamination and tunable conductivity. BALINIT A (TiN) is used for higher conductivity than DYLYN.

Soluzione Materiale di rivestimento Tecnologia Coating Durezza rivestimento HIT [GPa] Coefficiente di attrito (asciutto) rispetto all'acciaio Temp. max. di servizio [°C] Temperature di processo [°C]
a-C:H:Si PACVD ~ 15-25 0.05 - 0.2 350 < 220
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TiN Arc 30 +/- 3 ~0.6 600 < 500

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