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S3p –Scalable pulsed power plasma

S3p - Scalable pulsed power plasma

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S3p –Scalable pulsed power plasma

Arc Evaporation

Arc Evaporation

In arc evaporation, a small spot of a high electrical current moves on the surface of a target. The material immediately melts and the metal vapor condenses on the work piece. Because of the explosive nature of the process, droplets of liquid metal are formed, which may cause a rough surface of the coating surface. Reactive gas can be introduced to form compounds.

Process characteristics:
  • High degree of Ionization
Coating properties:
  • High density, high hardness
  • Excellent adhesion
  • Less smooth, droplets

Sputtering

Sputtering

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. In thin-film coating, this is achieved by accelerating Argon ions towards a solid target where they knock out metal atoms which are collected at the work piece. Compounds such as metal nitrides are formed by introducing gas in the vacuum chamber.

Process characteristics:
  • Low degree of Ionization
Coating properties:
  • Low density, low hardness
  • Moderate adhesion
  • Smooth surface

S3p

S3p

S3p combines the advantages of the arc evaporation and sputtering technologies:

  • High ionisation in the process without droplets
  • Smooth coating surface
  • Very high coating density and hardness
  • Excellent adhesion

The unique process window and the separate scalability of

  • Pulse duration
  • Pulse shape
  • Current density

open up unprecedented options in coating design. Customised coatings that precisely fulfil the requirements of the respective application are now reality with S3p.

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