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In arc evaporation, a small spot of a high electrical current moves on the surface of a target. The material immediately melts and the metal vapour condenses on the work piece. Because of the explosive nature of the process, droplets of liquid metal are formed, which may cause a rough surface of the coating surface. Reactive gas can be introduced to form compounds.
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. In thin-film coating, this is achieved by accelerating Argon ions towards a solid target where they knock out metal atoms which are collected at the work piece. Compounds such as metal nitrides are formed by introducing gas in the vacuum chamber.
A technological milestone has been achieved: BALIQ™ - the new coating generation by Oerlikon Balzers. It is based on our S3p technology (Scalable Pulsed Power Plasma) that intelligently combines the advantages of arc evaporation and sputtering.
The result is BALIQTM, a new family of wear-resistant coatings with revolutionary properties for a unique spectrum of applications. You benefit from new possibilities that transcend anything seen before – with coatings tailored precisely to your needs.
S3p combines the advantages of the arc evaporation and sputtering technologies:
The unique process window and the separate scalability of
open up unprecedented options in coating design. Customised coatings that precisely fulfil the requirements of the respective application are now reality with S3p.