Manufacturing Method Aluminum Silicon Metco 52C-NS Balance 12 Gas Atomized Amdry 355 Balance 12 Gas Atomized 2.2 Chemical Composition, Particle Size Distribution and Manufacturing Method Product Nominal
Complex conventional manufacturing present performance barriers and should be avoided.
Both changes require more advanced manufacturing technologies.”
facturing systems as well as a number of other applications. 1.1 Typical Uses and Applications n Plasma etch and erosion resistance on surfaces exposed to reactive plasma gases in semiconductor manufacturing
As innovation leader, Oerlikon Metco is forging new paths with materials for additive manufacturing (AM).
IATF USI: YNL62W Am Ockenheimer Graben 41, DE-55411 Bingen has been assessed and certified as meeting the requirements of IATF 16949:2016 Edition 1 For the following Scope Design and manufacturing of surface
IATF USI: PNLE6Y Auer Str. 42, DE 09366, Stollberg has been assessed and certified as meeting the requirements of IATF 16949:2016 Edition 1 For the following Scope Design and manufacturing of surface solutions
. ▪ Embrace the circular economy (e.g. repair, reuse, recycle) approach, responsible procurement and manufacturing. ▪ Achieve operational excellence in emissions reduction. ▪ Implement industry-leading
. ▪ Embrace the circular economy (e.g. repair, reuse, recycle) approach, responsible procurement and manufacturing. ▪ Achieve operational excellence in emissions reduction. ▪ Implement industry-leading
Oerlikon Metaplas GmbH IATF USI: C9GLXK Theodor-Heuss-Str. 63, 38228 Salzgitter, Germany has been assessed and certified as meeting the requirements of IATF 16949:2016 Edition 1 For the following Scope Manufacturing
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