Choose your country / language

Revolutionizing Semiconductor Equipment Manufacturing

Unlocking Efficiency and Precision with Additive Manufacturing

Additive Manufacturing is a game-changer for capital equipment manufacturers in the semiconductor industry, delivering immediate benefits. With AM's design flexibility and seamless transition from prototyping to customized part production, capital equipment manufacturers experience a significant advantage.

The improved thermal management of critical components like wafer tables, results in enhanced equipment accuracy, speed, and overall lifecycle value. Another key application involves optimizing fluid flow within complex manifolds. 3D printing technologies also offer structural optimization with lightweight, high-strength components, improving the strength-to-weight ratio, corrosion resistant materials,  and time-to-market. Moreover, AM simplifies manufacturing, eliminating the need for labor-intensive brazing and multipart assemblies.

Contact us

Applications and benefits

1. Enhanced Thermal Management

AM improves accuracy by 1–2 nm while boosting machine speed and uptime. Optimized internal cooling channels and surface patterns reduce temperature fluctuations and reduce time constants.

2. Streamlined Manufacturing

AM eliminates the need for brazing and multipart assemblies, reducing part count and labor costs. This results in more reliable wafer tables.

3. Fluid Flow Optimization

Complex fluid manifolds produced with AM offer reduced pressure drops, decreased disturbances, and improved accuracy by 1–2 nm.

4. Structural Optimization

AM allows for lightweight, high-strength parts, improving performance and reducing system vibration.

Why choose Oerlikon AM as your partner?

  • Global manufacturing capabilities meeting the needs of semiconductor supply chain
  • Materials developed specifically for the semiconductor industry (corrosion resistant)
  • Surface post processing know-how targeted for semiconductor needs including coatings
  • Experience with cleaning processes meeting semiconductor manufacturing requirements

© Copyright 2024 OC Oerlikon Management AG

Back to top keyboard_arrow_up