Conductive Filler Materials

E-Fill conductive filler materials excel in Electromagnetic and Radio Frequency Interference (EMI/RFI) shielding applications. We offer homogeneously coated metallic and non-metallic core materials that exhibit low resistance electrical contact with superior corrosion and heat resistance.
E-Fill materials are ideally suited for use in electronic devices. Our proprietary hydro-metallurgical process ensures a continuous, uniform coating resulting in a highly conductive filler material. These materials are available as metal-coated metallic or non-metallic core particles.
Superior properties of E-Fill products
- Electromagnetic Interference (EMI) shielding
- Radio Frequency Interference (RFI) shielding
- Conductivity
- Heat transfer
Typical applications
- Coatings Inks
- Adhesives
- Tapes
- EMI gaskets
- Elastomers
- Sealants
Trust our experience
Consult with us on the ideal conductive filler material for your application. We understand how to optimize cost and performance through selecting ideal powder characteristics, such as:
- Particle shape
- Size distribution
- Morphology
- Cladding thickness
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Nickel Powders for Conductive Filler Applications
Highly controlled manufacturing processes enable us to produce conductive nickel powders with extremely high purity and features tailored to your application. Our nickel powders have consistent particle shape …
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Gold Clad Conductive Filler
E-Fill gold-clad powders offer significant cost saving over pure gold powders without reducing performance. These products are environmentally stable, highly conductive, and ideal for filler applications. Our …
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Nickel Graphite Conductive Fillers for Electromagnetic Interference (EMI) Gaskets
E-Fill nickel graphite materials offer the shielding effectiveness of silver-clad fillers at a fraction of the cost. We optimize our materials to meet the requirements of your molded, extruded or form-in-place …
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