Conductive Filler Materials

E-Fill conductive filler materials excel in Electromagnetic and Radio Frequency Interference (EMI/RFI) shielding applications. We offer homogeneously coated metallic and non-metallic core materials that exhibit low resistance electrical contact with superior corrosion and heat resistance.

E-Fill materials are ideally suited for use in electronic devices. Our proprietary hydro-metallurgical process ensures a continuous, uniform coating resulting in a highly conductive filler material. These materials are available as metal-coated metallic or non-metallic core particles.

Superior properties of E-Fill products

• Electromagnetic Interference (EMI) shielding
• Radio Frequency Interference (RFI) shielding
• Conductivity
• Heat transfer

Typical applications

• Coatings Inks
• Adhesives
• Tapes
• EMI gaskets
• Elastomers
• Sealants

Trust our experience

Consult with us on the ideal conductive filler material for your application. We understand how to optimize cost and performance through selecting ideal powder characteristics, such as:

• Particle shape
• Size distribution
• Morphology
• Cladding thickness