Balzers, Liechtenstein, October 02, 2013 – Oerlikon’s Advanced Technologies Segment, a leading supplier of PVD deposition equipment, has received multiple orders for its CLUSTERLINE® 300 system for use in the manufacture of power devices. CLUSTERLINE® 300 is the first PVD tool worldwide that runs 300mm thin wafer backside metallization for power devices in production. “With the new CLUSTERLINE® 300, we can offer our customers significant advantages and again prove our technology leadership,” says Andreas Dill, CEO of Oerlikon’s Advanced Technologies Segment.
Depth of experience
In the semiconductor industry, power devices are a fast-growing market, which is primarily being driven by an increasing number of efficient energy-management requirements. Furthermore, modern power devices’ improved efficiency and low energy usage has fueled the replacement of conventional units. The first of Oerlikon’s solutions for 200mm power device manufacturing were qualified at customer sites more than 10 years ago, and today the thin wafer handling and processing capability of the CLUSTERLINE® 200 is the established solution at all major power device manufacturers and foundries. Oerlikon’s years of experience with power device production processes was a key factor in achieving accelerated qualification and enabling the successful transition from 200mm to 300mm volume manufacturing. Because a 300mm wafer has 2.25 times the area of a 200m wafer and similar throughput times, the CLUSTERLINE® 300 more than doubles productivity.
The platform offers both front side thick aluminum and thin wafer backside metallization for 300mm power device manufacturing. The adaption of 300mm wafer production for power devices requires innovative solutions as well as increased automation and wafer-handling capabilities. Following the successful on-site qualification of the system, Oerlikon has now received multiple orders for its new CLUSTERLINE® 300 from a leading power device manufacturer.
“We are pleased to offer customers a comprehensive solution for 300mm power device manufacturing as well, which builds on our success as leading supplier for the smaller wafer format in this fast-growing market,” says CEO Andreas Dill.
Oerlikon (SIX: OERL) is a leading high-tech industrial group specializing in machine and plant engineering. The Company is a provider of innovative industrial solutions and cutting-edge technologies for manmade fibers manufacturing, drive systems, vacuum, coating, and advanced nanotechnology. A Swiss company with a tradition going back over 100 years, Oerlikon is a global player with around 13 000 employees at around 160 locations in 34 countries and sales of CHF 2.9 billion in 2012. The Company invested in 2012 CHF 106 million in R&D, with over 1 000 specialists working on future products and services. In most areas, the operative businesses rank either first or second in their respective global markets.
About Oerlikon Systems
Oerlikon Systems focuses on production systems for advanced nanotechnology and semiconductor applications. The core competence of Oerlikon Systems in the thin-film coating technology enables solutions in the area of advanced nanotechnology for touch panels, photovoltaics, thermoelectric generators and energy storage, saving, conversion and transmission. Applications for the semiconductor market include advanced packaging, power devices, read/write heads for hard disks, LEDs and Micro-Electro-Mechanical Systems (MEMS). These solutions facilitate the production of chips, devices and components used in consumer electronics and various industrial sectors, including the information technology, telecommunications and automotive industries.
Headquartered in Liechtenstein, Oerlikon Systems employs 200 people around the world, with a global infrastructure of 18 sales, service and spare part centers.