Solution | Coating material | Coating technology | Microhardness HIT (GPa) | Coefficient of friction (dry) vs. steel | Max. service temp. [°C] | Process temperature | ||
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BALINIT DYLYN | a-C:H:Si | PACVD | ~15-25 | 0.0 5- 0.2 | 300 | < 220 |
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BALINIT A | TiN | Arc | 30 +/- 3 | ~0.6 | 600 | 500 |

Semiconductor wafer, chucks and pedestals
Products include BALINIT DYLYN for wear and contamination reduction and tunable electrical properties. Others include Y2O3 for etch-resistance, as well as TiN and CrN for wear and electrical conductivity