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Skiktalternativ Beläggningsmaterial Beläggningsteknik Mikrohårdhet HIT (GPa) Friktionskoefficient (torr) vs. stål Max. driftstemp. [°C] Processtemperatur
BALINIT DYLYN a-C:H:Si PACVD ~ 15-25 0.05 - 0.2 350 < 220
BALINIT A TiN Arc 30 +/- 3 ~0.6 600 < 500
image

Semiconductor wafer transfer mechanisms

BALINIT DYLYN coatings are used for the reduction of contamination and tunable conductivity. BALINIT A (TiN) is used for higher conductivity than DYLYN.