# S3p - Scalable pulsed power plasma

The Smooth Revolution

# S3p –Scalable pulsed power plasma

## Arc Evaporation

In arc evaporation, a small spot of a high electrical current moves on the surface of a target. The material immediately melts and the metal vapour condenses on the work piece. Because of the explosive nature of the process, droplets of liquid metal are formed, which may cause a rough surface of the coating surface. Reactive gas can be introduced to form compounds.

##### Process characteristics:
• High degree of Ionisation
##### Coating properties:
• High density, high hardness
• Less smooth, droplets

## Sputtering

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. In thin-film coating, this is achieved by accelerating Argon ions towards a solid target where they knock out metal atoms which are collected at the work piece. Compounds such as metal nitrides are formed by introducing gas in the vacuum chamber.

##### Process characteristics:
• Low degree of Ionisation
##### Coating properties:
• Low density, low hardness
• Smooth surface

## S3p

S3p combines the advantages of the arc evaporation and sputtering technologies:

• High ionisation in the process without droplets
• Smooth coating surface
• Very high coating density and hardness