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Tip acoperire Materialul acoperirii Tehnologia de acoperire Micro-duritate HIT (GPa) Coeficient de frecare (mediu uscat) vs. oțel Temp. max. de operare [°C] Temperatura de proces
BALINIT DYLYN a-C:H:Si PACVD ~ 15-25 0.05 - 0.2 300 < 220
BALINIT A TiN Arc 30 +/- 3 ~0,6 600 < 500
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Semiconductor wafer transfer mechanisms

BALINIT DYLYN coatings are used for the reduction of contamination and tunable conductivity. BALINIT A (TiN) is used for higher conductivity than DYLYN.