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Tip acoperire Materialul acoperirii Tehnologia de acoperire Micro-duritate HIT (GPa) Coeficient de frecare (mediu uscat) vs. oțel Temp. max. de operare [°C] Temperatura de proces
BALINIT DYLYN a-C:H:Si PACVD ~ 15-25 0.05 - 0.2 300 < 220
BALINIT A TiN Arc 30 +/- 3 ~0,6 600 < 500
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Semiconductor wafer, chucks and pedestals

Products include BALINIT DYLYN for wear and contamination reduction and tunable electrical properties. Others include Y2O3 for etch-resistance, as well as TiN and CrN for wear and electrical conductivity