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Enhanced Sputtering

Enhanced Sputtering

Enhanced sputtering employs a low-voltage arc discharge in the centre of the chamber to create a plasma intensity several times greater than the basic sputtering procedure, and thus to produce a much higher degree of particle ionization in the gaseous phase.

    <li>Electron beam source</li>
    <li>Reactive gas</li>
    <li>Planar magnetron evaporation source (coating material)</li>
    <li>Low-voltage arc discharge</li>
    <li>Auxiliary anode</li>
    <li>Vacuum pump</li>

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