| Javasolt megoldás | Bevonat anyaga | Bevonatolási technológia | Mikrokeménység HIT (GPa) | Súrlódási együttható acéllal (szárazon) | Max. üzemi hőm. [°C] | Bevonatolási hőmérséklet | ||
|---|---|---|---|---|---|---|---|---|
| BALINIT DYLYN | a-C:H:Si | PACVD | ~ 15-25 | 0.05 - 0.2 | 350 | < 220 |
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| BALINIT A | TiN | Arc | 30 ±3 | ~0,6 | 600 | < 500 |
Semiconductor wafer, chucks and pedestals
Products include BALINIT DYLYN for wear and contamination reduction and tunable electrical properties. Others include Y2O3 for etch-resistance, as well as TiN and CrN for wear and electrical conductivity