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Enhanced Sputtering

Enhanced sputtering employs a low-voltage arc discharge in the centre of the chamber to create a plasma intensity several times greater than the basic sputtering procedure, and thus to produce a much higher degree of particle ionization in the gaseous phase.

1. Electron beam source

2. Argon

3. Reactive gas

4. Planar magnetron evaporation source (coating material)

5. Components/Tools

6. Low-voltage arc discharge

7. Auxiliary anode

8. Vacuum pump

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