\uf1ad
Hautatu dagokizun produktua
×
×
Erantzuna Estaldura materiala Estaldura teknologia Mikrogogortasuna HIT (GPa) Marruskadura koefizientea (lehorra) altzairuaren aldean Zerbitzuren denb. max. [ºC] Prozesuaren tenperatura
BALINIT DYLYN a-C:H:Si PACVD ~ 15-25 0.05 - 0.2 300 < 220
BALINIT A TiN Arc 30 +/- 3 ~0,6 600 < 500
image

Semiconductor wafer transfer mechanisms

BALINIT DYLYN coatings are used for the reduction of contamination and tunable conductivity. BALINIT A (TiN) is used for higher conductivity than DYLYN.