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Solució de recobriment Material de recobriment Tecnologia de recobriment Microduresa HIT (GPa) Coeficient de fregament (sec) vs. acer Temperatura màx. de treball [ºC] Temperatura de procés
BALINIT DYLYN a-C:H:Si PACVD ~ 15-25 0.05 - 0.2 300 < 220
BALINIT A TiN Arc 30 +/- 3 ~0,6 600 < 500
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Semiconductor wafer transfer mechanisms

BALINIT DYLYN coatings are used for the reduction of contamination and tunable conductivity. BALINIT A (TiN) is used for higher conductivity than DYLYN.