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Semiconductor wafer transfer mechanisms

BALINIT DYLYN coatings are used for the reduction of contamination and tunable conductivity. BALINIT A (TiN) is used for higher conductivity than DYLYN.

Solució de recobriment Material de recobriment Tecnologia de recobriment Duresa recobriment HIT [GPa] Coeficient de fregament (sec) vs. acer Temperatura màx. de treball [ºC] Temperatura de procés [°C]
a-C:H:Si PACVD ~ 15-25 0.05 - 0.2 350 < 220
descarregar
TiN Arc 30 +/- 3 ~0.6 600 < 500

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