Precise and independent scalability of pulse duration, -shape and unique power scalability within S3p enables tailored coatings. The limits of conventional HiPIMS are overcome with the unique process window as well as significantly higher deposition rates and process stability.
The revolutionary smooth surface and the low defects of S3p based coatings enable smooth chip evacuation. A mechanical post-treatment is not needed. Adhesion of workpiece material especially for difficult to machine materials and build-up edges are avoided even with difficult-to-machine materials.
S3p based coatings stand out by a very good coating-substrate bonding. High adhesion – at least as high as with coatings deposited by Arc Evaporation - guarantees long and reproducible tool life times.
The coating density of S3p based coatings approaches bulk density. DC-sputter coatings show a more open columnar structure, with its disadvantage of lower toughness and less resistance to crack propagation and diffusion.