LLS EVO II Outstanding process and substrate flexibility combined with excellent reproducibility and film uniformity.

LLS EVO II

Features

  • Process flexibility: DC, RF, RF/DC combined, DC pulsed, co-sputtering up to three cathodes
  • Excellent reproducibility and film uniformity for consistent production quality
  • Degas and etch in load chamber isolates process chamber from contaminants
  • Easily convertible to various substrate sizes within 5 minutes
  • System with 5 cathodes is back in production within 5 hours (maintenance including target and shields exchange, pump time, target burn in)


Source

Highest process flexibility with 5 sources configurable for any of the following options:

  • DC sputtering: Conductive materials and low doped reactive processes
  • RF sputtering: Dielectric materials and high doped reactive processes
  • RF/DC combined sputtering: Increased rate of reactive sputtering
  • Pulsed DC sputtering: Improved performance of high and low doped reactive processes. Stress control for certain metals (e.g. Cr, NiV)
  • Co-sputtering: Parallel operation with up to three sources which enables:
  • Increased sputtering rates
  • Mixtures of alloys
  • Continuous phasing of materials


Hardware

  • Reliable industry proven production system
  • Moveable shutter:
    • Avoids cross contamination between sources
    • Individual pre-sputtering
  • Unique valve separates load-lock chamber (LC) and main chamber (MC) avoiding particles and gaseous contamination, assuring repeatable process conditions
  • Compact footprint (remote rack cabinets/pumps/compressors available in extended layout +15 m)
  • Three main units allow easy and fast plug and play installation


Substrates

  • Easily convertible for different substrate sizes and shapes within 5 minutes, customized substrate tooling:
    • Full face deposition
    • Customized edge exclusion, edge masking, shadow masking
    • Different substrate sizes within same batch possible
  • Batch capacity:
    • Standard wafer: 2”x 132; 3”x 72; 4”x 36; 5”x 30; 6”x 12; 8”x 9
    • Pieces of substrates up to max. 200 x 230mm (9 per batch)


Substrate Thickness

  • 2” ≤ 16mm, 3” ≤ 14.5mm, 4” ≤ 13mm, 5” ≤ 11mm, 6” ≤ 8.5mm, 8” ≤ 1.3mm


Substrate Handling

  • Substrate handling at atmosphere
  • No substrate handling inside the process chamber. Substrates are handled only as they enter or exit the load lock chamber
  • Manual or fully automatic 6-axis Robot cassette-to-cassette handling (CTC)
    • Either full face deposition on 125mm, 150mm and 200mm substrates (upon request for 2”, 3” and 100mm substrate diameters) or
    • Masked deposition for 200mm substrates
    • Complete Teaching can be done via GUI (no Teach-Pendant needed)
    • Cassette Buffer 1/2 and GUI are accessible from the same location
    • Flat / Notch Aligner 0-360° (Recipe parameter)
    • Barcode reader optional


Process

  • Load-lock chamber for degassing and RF or ion beam etching, assuring clean surfaces and good adhesion
  • Optimized rectangular cathode design for highest B-field uniformity resulting in better magnetic film properties and lifetime
  • Vertical sputtering generates fewer particles and allows longer kit lifetime
  • Optimized magnet array increases target lifetime (e.g. AI + 70%)
  • Temperature control (e.g., TiW UBM stack <120°C)
  • Segment sputtering: enables deposition on a single substrate (for precious materials / R&D)
  • Substrate heating (up to 350°C in MC, 200°C in LC – power controlled)


Control System

  • Operator friendly WindowsTM 7 based graphical user interface (on separate PC with ‘RAID 1’ mirroring) displays status and trends, tracks and registers process information, manages alarms and recipe handling
  • Siemens Simatic Microbox PC for real time control of all machine functions
  • SECS/GEM Interface (option)
  • Industry standard diagnostic and control equipment option, e.g. RGA. Data logging and run-protocols are an integral part of the control system
  • Media consumption reporting (ISO 14001)


Documentation

  • Operating instructions available in English, German & Japanese language
  • Integrated documentation comprises all documentation - available online (catalog creator)


Layout