HEXAGON The advanced packaging sputtering solution for high volume production.

HEXAGON The single wafer sputtering tool specifically designed for wafer level packaging and backside metallization for wafer sizes up to 300mm. The HEXAGON significantly increases wafer throughput, has half the footprint, and runs up to 5'000 wafers before requiring maintenance.
PRODUCTIVITY
Cost per Wafer
  • Highest throughput
  • Smallest footprint
  • Lowest energy consumption
Reliability
  • Proven process components
  • Proven material handling systems
  • Proven control backbone
Availability
  • Designed for organic passivated wafers
  • Highest wafer output per maintenance interval
  • Temperature controlled process chambers
Maintainability
  • Drop-in shield kits
  • Powered source handling
  • Automated maintenance services
FEATURES

300mm or 200/300mm Bridge Capability

Process Capabilities
  • Thermal pre-treatment (Degas)
  • Low temperature ICP etching
  • DC/DC-pulsed sputtering
  • Fast wafer transfer to minimize contamination
Process Chambers
  • Integrated stainless steel process chambers
  • Full process isolation
  • UHV pumping and vacuum capability
Chucks
  • Temperature controlled (heated or cooled)
  • Full face, clamped, ESC, floating
  • RF or DC biased
Transfer System
  • Up to four FOUP atmospheric front end stations
  • High troughput synchronous motion indexer
  • Wafer position monitoring
  • Mechanically confined wafer tansfers
  • Cryogenic gates and toroidal chamber design for open source isolation
Operability
  • Fully pre-integrated systems for fast installation
  • High spare part overlap with previous generation
  • > 90% process matching with previous generation
  • > 90% control and operation compatibility with previous generation

Technical Information
Throughput

  • 70 wafers-per-hour (Wph) handling limit
  • UBM processing with BKM (20nm Etch): 60 Wph
Footprint & Layout
  • 12m² equipment mainframe
  • 5m² support and control systems
  • 17m² total installation area

LESS THAN HALF OF ANY OTHER COMMERCIALLY AVAILABLE SYSTEM

Productivity 
  • Over 85% typical availability
  • Up tp 5'000 wafers maintenance intervals
  • Less than 6 hours total equipment maintenance time
  • Breakage rate less than 1:20'000
  • Meantime between failure over 500 hours

 

Contacts
Sven E. Jarby
P: +423 388 4792
F: +423 388 6254
Contact Us
Oerlikon Advanced Technologies AG
Iramali 18
9496 Balzers
Liechtenstein
Import as VCF