CLUSTERLINE® 200 II The high volume production platform of choice for highly sophisticated and specialized applications.

CLUSTERLINE® 200 II The CLUSTERLINE® 200II provides state-of-the-art process capabilities as well as extensive pre-and post-treatment steps. The open system architecure allows easy tool configuration for PVD, highly ionized PVD, Soft Etch and PECVD for wafer sizes up to 200mm.


  • High throughput platform for state-of-the-art PVD, Soft Etch and PECVD applications
  • Automatic wafer alignment correction under vacuum
  • Sophisticated process and auxiliary modules with high vacuum integrity provide excellent film properties and repeatability
  • Open system architecture, easily configurable and expandable
  • Reliable, industry proven production system with up to 6 process modules and up to 6 auxiliary modules for pre- and post-treatment steps
  • Auxiliary module functions including wafer alignment, buffer, degas, cooling, and ID reader



  • Advanced vacuum handling platform for highest wafer yield and easy operation
  • Most accurate wafer placement and automatic wafer alignment correction under vacuum
  • Two loadlock cassette stations with auto-home, featuring ergonomic loading, soft pump and soft vent, mapping functions to detect cross-slotted, double-loaded wafers, instant wafer slide out (protrusion) detection
  • Magnetically driven robot system with dual bisymmetric arms
  • Production-proven thin wafer handling and processing capability for wafer thickness down to 70 μm and wafer bow up to 6mm, carrier solution for thinner wafers
  • Modular chuck design for fast size and configuration conversion (4”, 5”, 6” and 8”)

Control System

  • Advanced cluster tool control system with ControlWorks® software
  • High speed Ethernet backbone with standardized, distributed I/O system
  • User friendly GUI with standard PC running Windows 7™ and ‘RAID1’ mirroring
  • Real time process flow, sequence and step editors, choice of sequential or parallel wafer routing as well as carrier scheduling functions
  • Closed ballroom compatible racks
  • Fab integration with SEMI SECS/GEM interface
  • Real time parameter control and display
  • Data logging for process review (tabular and graphic)
  • Secure operation with multiple user group designations
  • Warning and alarm reporting


Process Modules / Components

  • Production-proven planar magnetron sputter sources with high target utilization (rotating magnetic system) or Flexicath™ for extremely high film uniformity and homogeneity requirements with flexible configurations for all state of the art applications
  • Highly ionized PVD source technology for high aspect ratio TSV applications - mainly for 3D packaging
  • The Plasma Box® design of the PECVD process module features a separate reactor within the process chamber providing outstanding uniformity and avoiding contamination by differential pumping and in-situ cleaning. The concept allows a very high film purity and excellent control of interfaces and doping
  • ICP soft etch process module with MF Plasma enhanced RF Etch enabling high etch rate and excellent uniformity at low bias voltages. Reactive processing with H2, N2 and O2 is available
  • Cooled Metal Cage (Ice Dome) and arctic chuck cooling down to -30°C, enabling highest kit life in the etch module for organic wafers like PI or PBO
  • Degas module for fast wafer conditioning and repeatable process results
  • Electrostatic (ESC), clampless or clamped chucks using gas conduction for active wafer cooling or heating in PVD and soft etch modules
  • Chuck RF Bias
  • RF and DC sputter sources available
  • Multisource with rotating chuck - up to 4 sources on one module for single target or simultaneous sputtering (4x DC, 2x DC + 2x RF, 3x DC + 1x RF/DC), optional target and substrate shutter
  • Controlled chuck temperature from -30 up to 800°C
  • Shutter between target and wafer for target cleaning
  • Magnetic alignment feature to orient magnetic films
  • Optional APC with fully integrated Pyrometer and process gas monitor