LLS EVO II Batch sputtering system for MMIC metallization, resistors, optical components, UBM, sensors, and other applications
The LLS EVO II features huge application flexibility plus unparalleled process options – more substrates per invested dollar.
LLS EVO II Benefits
- Up to 5 planar magnetrons (DC, RF, pulsed DC, RF/DC combined) offer the ultimate in process flexibility
- Co-sputter capabilities enabling phases of two materials
- Features a constant and uniform deposition rate, giving the best yield in the industry
- Can be configured as a fully-automated turnkey system with an easy-to-use Windows XP™-based controlling system
- option: Automatic wafer handling (cassette-to-cassette), unmasked or masked with barcode reader
Typical Performance
Batch capacity:
4" 36 substrates, 4" 30 substrates, (sq.) 6" 12 substrates, 8" 9 substrates
Load lock
- Degas heater
- RF clean etch or ion milling
Process chamber
- Quartz heater:Temperature up to 370°C
- DC planar magnetrons: For metals: Au, AuGe, Cr, Cu, NiFe, TiW, Al, Ta, Ti, Co, etc
- Co-sputtering:For perfect phasing and to increase the throughput
- DC assymetric pulsed:For low conductive materials TaN, TiN (oxides/nitrides)
- RF sputtering: For non conductive materials, Cermet (SiO2, Al2O3)