Backside Metallization and Thin Wafer Processing
Backside Metallization is predominantly applied to thinned wafers for power device production (IGBT, Power MOS...) where the sputtered films create the electrical contact as well as the solder base for the contact to the heat sink.
CLUSTERLINE® 200 II
The CLUSTERLINE® 200 II provides the industry proven sputtering system for backside metallization and thin waf...
CLUSTERLINE® 300 II
The CLUSTERLINE® 300 II is a unique industry proven sputtering system with wafer flip for backside metallizati...
LLS EVO II
The LLS EVO II is a highly flexible batch sputtering system for advanced applications like several UBM process...