Advanced Packaging addresses the underbump metallization (UBM) and redistribution (RDL) applications of advanced packages such as Flip Chip, WL-CSP, and SiP as well as TSV metallization for 2.5D & 3D packaging and integrated passives.
Advanced Packaging Solution for high volume production
CLUSTERLINE® 200 II & CLUSTERLINE® 300 II
The CLUSTERLINE® is a unique industry proven sputtering system for UBM (underbump metallization) and RDL (redi...
LLS EVO II
The LLS EVO II is a highly flexible batch sputtering system for advanced applications like several UBM process...