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Oerlikon Wafer Processing offers innovative production solutions for deposition and etch. <BR><BR>
CLN 200 II / CLN 300 / CLUSTERLINE 200 II / CLUSTERLINE / CLUSTERLINE 300
LAPECVD
VERSALINE / VLN / Versaline
VERSALOCK / VRL / Versalock
SHUTTLELINE / Shuttleline
LLS EVO II
MASK ETCHER / Mask Etcher / Soft Etch / Dry Etch
PVD, PECVD,ICP,Plasma enhanced.<BR>
APC Advanced Process Control Plasma Box ESC / Electrostatic<BR>
Control Works
SEMI SECS / GEM interface
Load Port Modules
Mini Environment
Scara Robots
Wafer flip
ARQ
RF-Bias
CVD / Chemical Vapor deposition
DC sputtering
RF sputtering
Pulsed DC sputtering
CO-sputtering
RF / DC combined sputtering
Target
Vacuum
MEMS
3D advanced packaging
Selectable SiNx
INP and PHF or Pulsed High Frequency<BR>
RIE or Reactive Ion Etching, HiPOE or Hight Performance Oxide Etching<BR>
AWG Damascene Structures PCP MMIC Cluster tool Semiconductor.<BR>
Semiconductors Wafer
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