oerlikon

Oerlikon Assembly Equipment benefited from this development in 2006 and achieved an increase in sales of 23 percent from CHF 192 million to CHF 236 million. This growth in sales clearly exceeded the market average. Orders received increased from CHF 206 million to CHF 222 million. The reasons behind these excellent operating results are, in addition to strong market demand, excellent ability to supply, short lead times and the successful market launch of new products. Optimized manufacturing processes and improved flexibility at the Cham site as well as the transfer of Wire Bonder production to Singapore resulted in improved efficiency and, combined with a strong increase in sales, in higher yields.

Milestones in 2006

• The Die Bonder 2008 hS^plus platform introduced in 2005 is a resounding success on the market. With an increased production output of up to 40 percent owing to a new pick & place module and the integration of a new, faster vision system, it provides considerable added value for the customer. Further innovative solutions, in particular in the sector for thin chips for the production of stacked die, confirm Oerlikon's market leading position in the die bonder sector.
  
  
• In the second quarter, Oerlikon Assembly Equipment introduces the Wire Bonder 3100^optima with new high-performance technology (doublegripper indexer) and the world's fastest changeover time. This increases productivity by up to 30 percent. This is a perfect complement to the existing Wire- Bonder product family which is now in excellent shape for 2007.
  
  
• Oerlikon Assembly Equipment transfers Wire Bonder production to Singapore with great success and in doing so continues to expand its global presence.

Outlook

Based on a growth forecast for the chip market, Oerlikon Assembly Equipment expects a seasonal weakening of the back-end equipment market in the first half of 2007. As the maximum output of chip manufacturers is always in the fourth quarter as a result of Christmas trading, major investment in systems is expected from the semiconductor industry in the second half of the year.

Oerlikon Assembly Equipment supports its customers' sustainable success

Micronas
A fruitful relationship has been ongoing between Micronas, the worldwide producer of semiconductors and Oerlikon Assembly Equipment - both companies derive long-term benefits from each other's know-how. Oerlikon develops solutions to match its customers' needs closly. «It is in particular those revolutionary developments which assist us greatly with the achievement of continuous improvements in terms of quality and cost efficiency and thus with securing the sustainable competitiveness of our European manufacturing sites», says W. Lowinski, General Manager and Vice President Operations Backend, when explaining the high customer benefits.